File:DARPA amplifier on silicon USC.jpg

Summary
https://commons.wikimedia.org/wiki/File:DARPA_amplifier_on_silicon_USC.jpg Description English: Two teams of DARPA performers have achieved world record power output levels using silicon-based technologies for millimeter-wave power amplifiers. RF power amplifiers are used in communications and sensor systems to boost power levels for reliable transmission of signals over the distance required by the given application. These breakthroughs were achieved under the Efficient Linearized All-Silicon Transmitter ICs (ELASTx) program. Further integration efforts may unlock applications in low-cost satellite communications and millimeter-wave sensing. Performers at the University of Southern California and Columbia University, achieved output power levels of nearly 0.5 W at 45 gigahertz with a 45 nanometer silicon complementary metal oxide semiconductor (CMOS) chip. This world record result for CMOS-based power amplifiers doubles output power compared to the next best reported CMOS millimeter-wave power amplifier. The chip design used multiple stacked 45 nanometer silicon-on-insulator CMOS devices for increased effective output voltage swing and efficient 8-way on-chip power-combining. Results will be reported at the 2013 Institute of Electrical and Electronics Engineers Radio Frequency Integrated Circuits Symposium. See http://www.darpa.mil/NewsEvents/Releases/2013/03/26.aspx for more details. Date	5 March 2013 Source	Defense Advanced Research Projects Agency (DARPA) Author	University of Southern California and Columbia University